Kemboen composite materials (Kunshan) Co., Ltd.: SlimFlex foam empowers 3C electronic precision sealing and buffering new scheme.
As 3C electronic products such as smart phones, tablet computers, notebook computers, and smart wear continue to iterate in the direction of thinness, high integration, and high reliability, the internal structural gaps are constantly narrowing, and the performance requirements for cushioning, sealing, dustproof, and shading materials are constantly improving. Kemboen Composite Materials (Kunshan) Co., Ltd. has been deeply involved in the supporting market of electronic materials in the Yangtze River Delta. Relying on the regular brand channels and mature application experience, SlimFlex microcellular foam, which is mainly promoted, has become a widely recognized functional material in 3C electronic precision structure design with its stable comprehensive performance, providing integrated cushioning, sealing and gluing solutions for consumer electronics enterprises.
SlimFlex foam is a high-density microporous polymer material, and its uniform and delicate microporous structure is its core basic advantage. Different from ordinary foam materials, the most prominent feature of this product is its extremely low compression set. Under the working conditions of long-term pressure, repeated opening and closing, and continuous vibration of electronic products, the material is stable in rebound, and it is not easy to collapse and relax. It can maintain the sealing gap for a long time, avoid problems such as screen light leakage, dust entry in the body, loose and abnormal sound of parts caused by foam failure, and adapt to many sealing buffer points such as mobile phone screen, LCD/OLED display module, camera, speaker, PCB motherboard, battery periphery, etc., and effectively fill tiny gaps between precision parts.
In terms of sealing protection, SlimFlex foam has excellent air tightness, dustproof and shading ability. The dense microporous structure can prevent dust from invading the interior of the fuselage, and at the same time prevent stray light from leaking out of the backlight module to ensure the stable screen display effect; Some specifications have the characteristics of low outgassing, less precipitates in high-temperature working environment, no white fog on the surface of lens and display panel, no pollution to optical components, which well solves the pain point of precipitation pollution in long-term use of high-end 3C products and meets the strict clean use requirements of consumer electronics. According to different customer needs, Kenborn can provide a series of brands such as flame retardant, heat resistant, antistatic and PET composite support, which can adapt to different product safety regulations and environmental testing standards. Some flame retardant models can meet the industry flame retardant specifications and reduce the risks caused by thermal runaway of electronic products.
Thin and light adaptability is the key highlight of SlimFlex foam to adapt to contemporary 3C product design. The material has high thickness precision, and can realize the stable supply of ultra-thin specifications. With the balance of soft and hard models of PET support layer, it can not only provide soft buffering in a limited stacking space, but also not cause extrusion damage to the screen, lens coating and thin-walled plastic parts. When the equipment falls or bumps, the foam can quickly absorb the impact energy, disperse the external force, protect the fragile components such as display module, chip and battery, and at the same time suppress the vibration transmission, reduce the resonance noise generated when the horn and motor work, and improve the acoustic experience of the whole machine.
In terms of processing and mass production adaptation, SlimFlex foam has excellent dimensional stability, excellent die-cutting performance, neat cut surface, and is not easy to chip off and wire drawing. It is suitable for automatic processes such as high-speed die-cutting, adhesive bonding and automatic mounting, which is conducive to improving the processing yield of electronic factories and controlling production costs. Based in Kunshan, near Shanghai and Suzhou, with branches in Dongguan and Vietnam, and close to 3C manufacturing clusters at home and abroad, Kemboen Composite Materials (Kunshan) can quickly respond to the demand of sample proofing, specification selection and batch delivery, and provide customers with one-stop services from material selection, structure suggestion to supporting processing.
Environmental compliance is also an important advantage of this material. SlimFlex foam meets the environmental control requirements of mainstream electronic industries such as RoHS and REACH, and there is no migration of harmful substances, which is suitable for the certification requirements of export-oriented consumer electronic products. Facing the emerging challenges of new materials for new generation 3C products such as smart wear, folding screen and AR terminal, Kenborn continued to follow up the requirements of terminal structure testing, and combined with the characteristics of various materials of SlimFlex, continued to optimize the sealing, buffering and noise reduction schemes to help customers solve the structural pain points in thin and light design.
At present, the competition in 3C industry is becoming increasingly fierce, and the stability, consistency and delivery efficiency of materials directly affect the quality of end products. Kemboen Composite Materials (Kunshan) Co., Ltd. will continue to give full play to the advantages of channels and technical services, take SlimFlex high-performance foam as the core, and continue to deeply cultivate consumer electronic track, providing reliable and stable selection of new sealing and buffering materials for domestic 3C manufacturing enterprises, and helping domestic consumer electronic products to continuously upgrade in lightness, durability and reliability.
